YSC 3D BgaScope is the ultimate digital video microscope system for inspecting BGA solders joints.  With 90 degree super angle viewing, solder joints under BGA packages can be seen with clarity.  Focus adjustments are also available for viewing between internal BGA rows and partial inner back 7th or 8th rows.  Typical X-Ray system will offer very quick top down viewing, but cannot see horizontal side view, which can be seen with YSC 3D BgaScope.  The system has internal optical rotation for fine internal viewing angle control without adjusting SMT board.  This feature is especially beneficial when viewing larger SMT PCB.  With replaceable viewing prism tips, operators can easily self maintain the system avoiding any downtime.  The system is also configured with metal halide light source for exceptional light intensity to provide optimal image quality.  Standard system is configured with high-resolution digital video analog CCD camera for real time viewing with s-video and composite video outputs, which can be connected with video frame grabber card for taking pictures (jpg, bmp or tif formats) and video measurement software for taking size measurements.  1.4 or 2 mega pixel camera option is also available. The system has a large base stand with double-sided board holder to handle various SMT PCB sizes.  If you are doing BGA, please consider various YSC BgaScope models to meet your budget and application needs.

3D Images 2 Mega Pixel Images

	Rotation View from YSC 3D BGAScope
	Inner Rows View from YSC 3D BGAScope
	Operation View from YSC 3D BGAScope