Semiconductor
• PANASONIC, SAMSUNG TECWIN, SONY LSI, SONY SEMICONDUCTOR, HITACHI, FUJIFILM, RICOHElectronics
• HITACHI, TOSHIBA, MITSUBISHI, PANASONIC, SONY, SHARP, NEC, FUJITSU, CANON, RICOH, MINOLTA, SAMSUNG, LG, GE, TI, SEAGATE, WDElectronics
• ALTECH, SEIKO EPSON, NIKON, OLMPUS, HITACHI HIGH-TECH, MITSUBISHI PRECISION* Ultra Sonic Cleaning 2000FPS
* Gas Nozzle Analysis with 8000FPS and Schlierensystem
* Contact Angle of Droplets 200fps
* Chip Packing 8000FPS
* Contact Angle of Water 2000FPS
* Mechanism Element 200FPS
* Wire Bonder 1000FPS
* Air Flow Inside the Manufacuring Machine 2D2C PIV
* Nozzle Flow 2D2C PIV
* Refrigerator Flow 2D2C PIV
* Spring Behavior 200FPS
* Pressing Machine Vibration 1000FPS
* Condensor Vibration 1000FPS
* Chip Mount 3D 2000FPS Stereo