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YSC PowerScope U4200 (30X to 4200X) Request for Quote
 
YSC PowerScope U4200 30X to 4200X Digital Video Inspection Microscope and Measurement with optional SXGA or UXGA megapixel cameras.
YSC PowerScope U4200 offers High Resolution Digital/Video Inspection and Measurement System with zoom range from 30X to 4200X using changeable lens adapters. The system is ideal for inspection, documentation and measurement of micro electronics, SMT, wafer and semiconductor applications. Both coaxial and ring lighting options are available. The system can be configured with our video measurement software and ImagePower System for image Multi-Focusing and Tiling, and other video accessories. Various stand and X-Y-Z stages (manual or motorized) can be used, and tilting stage is available for viewing object at an oblique 3D angle.

YSC PowerScope U4200 Actual Images
30X Hybrid
30X Hybrid 1
60X Decap

75X Hybrid

210X Copper
240X Wire Wedge
300X Ball Wire
300X Broken Wire Bond
300X Fiber
300X Hybrid Package
300X Stain
420X Laser Etch
 
450X Breakage
450X Flatten Wire
730X DIE
900X Contamination
     
1200X Medical Stent Plating
1200X Probe Card Mark
1500X Broken Wire
1800X Wire
     
2100X Probe Card Tip
2940X Chip
3000X -Probe Card Mark
4200X IC

YSC PowerScope U4200 Hardware
Logn-Working-Distance-Object
Long-Vertical-Travel-Stand
PowerScope ImagePower System

Video & Accessories

ImagePower System for Measurement, Multi-Focus and Tiling
Video Measurement Software
Flat Panel Computer Monito
Flat Panel LCD Monitor

Video Capture and Display Card

Portable Sony Memory Stick and Video Recorder
Video Printer
Various Stand Options
XY Stage for Double Sided SMT Board
Manual or Motorized XYZ Measurement Stages
Double Sided SMT Board XY Stage
Lighting Accessories



free hit counter

YSC PowerScope U4200 High Resolution Digital Video Inspection Microscope and Measurement System with 30X to 4200X magnification option is great for demanding digital video inspection, documentation and measurement for SMT, Semiconductor, Medical Device, BGA, microBGA, CSP and Flip Chip packaging, and wafer IC applications. The system can be configured with optional SXGA and UXGA digital video cameras and also XY video measurement software and XY or XYZ Measurement Stage.

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