YSC Scope 8000 for BGA, microBGA and Flip Chip

YSC Scope 8000 Video Microscope for BGA, microBGA, CSP and flip chip applications views what x ray cannot view and more economical than Ersa Scope and Ersa Scope 2.YSC Scope 8000 is a High-Resolution Digital Video Inspection and Measurement System ideal for inspecting solder joints of mounted BGA components, Column Grid Array, micro BGA, Chip Scale Package or Lead-Free process. Specialized optical and lighting design offers 90 degree horizontal viewing with high clearance over heat sinks or tall components on top of BGA. Safety features are designed into the system to ensure easy operation. Flat fiber brush for back lighting allows inspection of inner 7th or 8th BGA rows. The system can be configured with regular TV monitor for inspection viewing and computer system for image capturing or comparison, measurement software or digimatic meter for XYZ measurement. Large 17"x20" base and optional x-y sliding stage is ideal for small to large BGA boards.



YSC Scope 8000 for BGA, microBGA and Flip Chip Actual Images
     
Bottom Crack
Fracture
J Lead Crack

Measurement Software Option

     
Odd Shape
Open
QFP
QFP Heel
         
Scaling
View Inner 7th Row



YSC Scope 8000 for BGA, microBGA and Flip Chip Hardware
Double Sided SMT Board XY Stage
Flat Fiber Brush for Back Lighting
Large Base Stand with Adjustable Boom Arm and Tilting Focus Block-monitor
Tilt Adjustable Focus Block
Ultra Bright Light Source small size
XY Sliding Stage Option



Video Accessories

ImagePower System for Measurement, Multi-Focus and Tiling
Video Measurement Software
Flat Panel Computer Monito
Flat Panel LCD Monitor

Video Capture and Display Card

Portable Sony Memory Stick and Video Recorder
Video Printer
Various Stand Options
XY Stage for Double Sided SMT Board
Manual or Motorized XYZ Measurement Stages
Double Sided SMT Board XY Stage
Lighting Accessories

free hit counter

YSC Scope 8000 Digital Video Inspection and Measurement System for BGA, microBGA, CSP and Flip Chip applications is an economical alternative to help you see what X Ray system cannot. The thin prism tip design offers 90 degree super angle viewing of BGA, microBGA, CSP and Flip Chip solder joints, whereas X Ray typically just gives you top down viewing. Easy to use video measurement software can measure ball height, pitch width, co-planarity for your lead free process control.

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